The European Commission has approved, under EU state aid rules, a €450 million (CZK 12 billion) Czech measure to support US chipmaker Onsemi in setting up a novel integrated chip manufacturing plant for Silicon Carbide (‘SiC’) power devices in Rožnov pod Radhoštěm. The measure will contribute to increasing the EU’s technological autonomy in semiconductor technologies.
The aid will take the form of an approximately €450 million (CZK 12 billion) direct grant to Onsemi to support the company’s €1.64 billion (CZK 39.6 billion) investment. The new facility, which is expected to start commercial operations by 2027, will be first-of-a-kind in the EU. The plant will use innovative manufacturing technologies and manufacture products with superior performance, currently not present in Europe.
A press release is available online.
