SANTA CLARA, Calif. — Lorentz Solution, Inc., the world’s leading provider of 3D electromagnetic (EM) design platforms for IC, 3DIC, and advanced packaging, today announced that it is jointly presenting with NVIDIA at the TSMC 2026 Open Innovation Platform (OIP) Ecosystem Forum, to be held on Sept 23, 2026 in Santa Clara, CA. Their paper, “Large-scale Chip-level 3D EM Extraction and Sign-off of Ultra-high-speed Silicon Photonics and Custom Silicon IC/3DIC Designs with PeakView®,” marks the third consecutive year that Lorentz™ and NVIDIA will present cutting-edge EM technologies for real silicon designs at TSMC OIP.
